Physics-based 3D extraction environment for RLCG passive RF components and interconnect parasitics
RC Extractor for Realistic 3D Structures. Uses GDSII mask data and process information to create a realistic 3D structure for MEMS, advanced CMOS, TFT, Memory cells, etc.
3D RF Passive Device Modeling. Calculates 3D frequency dependent inductance, resistance, capacitance and capacitive loss for any multi-port network for RF SPICE analysis.